SUS304 + oxygen-free copper welding backing plate
This is a backing plate that combines stainless steel (SUS304) and oxygen-free copper (C1020) through welding.
This is a backing plate that combines stainless steel (SUS304) and oxygen-free copper (C1020) through welding. Since stainless steel (SUS304) and oxygen-free copper (C1020) are dissimilar metals, they have different thermal conductivities, making them difficult to process together. Therefore, we used a special processing method to ensure that the welding bonds not only the surface but also the inner surfaces in contact. Additionally, the overall structure adopts a jacket structure with water channels. This example is a backing plate used in the thin film technology of hard disks, and backing plates like this are one of our specialties. We have also produced many research and development products for research institutions such as universities, in addition to the semiconductor and medical fields. Furthermore, we can provide suggestions from the drawing creation and design stage. If you require a backing plate, please feel free to contact us before creating the drawings.
- Company：アイジェクト
- Price：Other
